| 전자부품 데이터시트 검색엔진 |
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LTC1850IFW 데이터시트(PDF) 27 Page - Linear Technology |
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LTC1850IFW 데이터시트(HTML) 27 Page - Linear Technology |
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27 / 28 page ![]() 27 LTC1850/LTC1851 18501f PACKAGE DESCRIPTIO FW Package 48-Lead Plastic TSSOP (6.1mm) (Reference LTC DWG # 05-08-1651) FW48 TSSOP 0502 0.09 – 0.20 (.0035 – .008) 0 ° – 8° 0.45 – 0.75 (.018 – .029) 0.17 – 0.27 (.0067 – .0106) 0.50 (.0197) BSC 6.0 – 6.2** (.236 – .244) 7.9 – 8.3 (.311 – .327) 13 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 12.4 – 12.6* (.488 – .496) 1.20 (.0473) MAX 0.05 – 0.15 (.002 – .006) 2 48 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 47 C .10 -T- -C- MILLIMETERS (INCHES) DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED .152mm (.006") PER SIDE DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS 2. DIMENSIONS ARE IN 3. DRAWING NOT TO SCALE * ** 0.32 ±0.05 0.50 TYP 6.2 ±0.10 8.1 ±0.10 RECOMMENDED SOLDER PAD LAYOUT 0.95 ±0.10 Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. |
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