AD9237_17 datasheet(23/25 Pages) AD

23 / 25 page

AD9237

Data Sheet

Rev. C | Page 22 of 24

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

EXPOSED

PAD

PIN 1

INDICATOR

3.25

3.10 SQ

2.95

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.25 MIN

Figure 47. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

5 mm × 5 mm Body, Very Very Thin Quad

(CP-32-7)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option2

AD9237BCPZ-40

–40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP_WQ)

CP-32-7

AD9237BCPZRL7-40

–40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP_WQ)

CP-32-7

1 Z = RoHS-Compliant Part.

2 Formerly CP-32-2 package.

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