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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LHT6MF 데이터시트(PDF) 12 Page - OSRAM GmbH |
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LHT6MF 데이터시트(HTML) 12 Page - OSRAM GmbH |
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12 / 22 page  2015-06-18 12 Version 1.0 LH T6MF Recommended Solder Pad 9) page 21 Reflow soldering Empfohlenes Lötpaddesign 9) Seite 21 Reflow-Löten Recommended Solder Pad 9) page 21 Reflow soldering Empfohlenes Lötpaddesign 9) Seite 21 Reflow-Löten OHLPY970 2.6 (0.102) Cu-area > 16 mm Cu-Fläche > 16 mm 2 2 Solder resist Lötstopplack 2.6 (0.102) Padgeometrie für improved heat dissipation verbesserte Wärmeableitung Paddesign for OHLPY440 Padgeometrie für verbesserte Wärmeableitung improved heat dissipation Paddesign for Lötstoplack Solder resist 0.8 (0.031) 2.3 (0.091) 3.3 (0.130) Cu Fläche / 16 mm per pad 2 Cu-area _ < 3.3 (0.130) Kathode/ Cathode Anode 0.7 (0.028) Fläche darf bei Verwendung von TOPLED® For TOPLED® assembly do not use elektrisch nicht beschaltet werden. this area for electrical contact Fläche darf bei Verwendung von TOPLED® For TOPLED® assembly do not use elektrisch nicht beschaltet werden. this area for electrical contact |
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