Preliminary Technical Data

AD9736/AD9735/AD9734

Rev. PrJ | Page 9 of 42

PACKAGE OUTLINE

SEATING

PLANE

0.25 MIN

DETAIL A

0.55

0.50

0.45

BALL DIAMETER

0.12 MAX

COPLANARITY

0.80 BSC

10.40

BSC

A

B

C

D

E

F

G

H

J

K

L

M

N

P

14

13

12

11

10

8

7

6

3

2

1

95

4

1.00

0.85

A1 CORNER

INDEX AREA

1.40 MAX

TOP VIEW

12.00

BSC SQ

BALL A1

INDICATOR

DETAIL A

COMPLIANT WITH JEDEC STANDARDS MO-205-AE.

a

160-Lead Chip Scale Ball Grid Array [CSPBGA]

(BC-160)

Dimensions shown in millimeters

BOTTOM

VIEW

Figure 7. AD9736 BGA Package Outline Drawing

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features proprietary

ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges.

Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.

Ordering Guide

Model

Temperature Range

Description

AD9736BBC

-40

°C to +85°C (Ambient)

160-Lead Chip Scale BGA

AD9736-EB

25°C (Ambient)

Evaluation Board

Table 4: Ordering Guide