Specifications with standard typeface are for T

Temperature range.V

Ω,R

Ω) unless otherwise stated (Note 3)

Symbol

Parameter

Conditions

Min

Typ

Max

Units

OUTPUT_B Peak

Current Sink

1

A

OUT_B Low

Saturation

10mA,

12

18

Ω

OUTPUT_B Rise Time

C

20

ns

OUTPUT_B Fall Time

C

15

ns

Output Timing Control

Overlap Time

R

Ω connected to

GND, 50% to 50%

transitions

75

105

135

ns

Deadtime

R

Ω connected

to REF, 50% to 50%

transitions

75

105

135

ns

Thermal Shutdown

T

SD

Thermal Shutdown

Threshold

165

˚C

Thermal Shutdown

Hysteresis

25

˚C

Thermal Resistance

θ

JA

Junction to Ambient

MTC Package

125

˚C/W

SDA Package

32

˚C/W

Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device

is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.

Note 2: For detailed information on soldering plastic TSSOP and LLP packages, refer to the Packaging Data Book available from National Semiconductor

Corporation.

are guaranteed by correlating the electrical characteristics to process and temperature variations and applying statistical process control.

Note 4: Device thermal limitations may limit usable range.

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