LCWMVSG.EC datasheet(17/26 Pages) OSRAM

전자부품 데이터시트 검색엔진

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LCWMVSG.EC 데이터시트(PDF) 17 Page - OSRAM GmbH

부품명	LCWMVSG.EC

상세설명	Small size high-flux LED for slim designs

PDF	26 Pages

Scroll/Zoom	100%

제조업체	OSRAM [OSRAM GmbH]

홈페이지	http://www.osram.com

Logo

17 / 26 page

Version 1.0

LCW MVSG.EC

2014-02-21

Recommended Solder Pad 8) page 25

Reflow soldering

Empfohlenes Lötpaddesign 8) Seite 25

Reflow-Löten

Note:

For superior solder joint connectivity results we

recommend soldering under standard nitrogen

atmosphere. Package not suitable for ultra

sonic cleaning.

Anm.:

Um eine verbesserte Lötstellenkontaktierung zu

erreichen, empfehlen wir, unter Standard-

Stickstoffatmosphäre zu löten. Das Gehäuse ist

für Ultraschallreinigung nicht geeignet.

OHLPY978

Paddesign

for improved

heat dissipation

Cu-area > 16 mm

Cu-Fläche > 16 mm

Wärmeableitung

Padgeometrie

für verbesserte

Lötstopplack

Solder resist

0.8 (0.031)

2.8 (0.110)

0.8 (0.031)

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