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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LEBQ7WP 데이터시트(PDF) 15 Page - OSRAM GmbH |
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LEBQ7WP 데이터시트(HTML) 15 Page - OSRAM GmbH |
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15 / 24 page  Version 1.9 - OS-PCN-2016-024-A LE B Q7WP 2017-05-11 15 Recommended Solder Pad 7) page 23 Reflow soldering Empfohlenes Lötpaddesign 7) Seite 23 Reflow-Löten Note: Do not use exposed copper MCPCB technology for automotive applications For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for any kind of wet cleaning or ultrasonic cleaning. Anm.: Für Automobil Anwendungen darf kein exposed copper MCPCB verwendet werden. Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- Stickstoffatmosphäre zu löten. Das Gehäuse ist für alle Arten einer nasschemischen Reinigung und Ultraschallreinigung nicht geeignet. |
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