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9

Physical Dimensions

8°

0°

SEE DETAIL A

NOTES: UNLESS OTHERWISE SPECIFIED

A) THIS PACKAGE CONFORMS TO JEDEC

MS-012, VARIATION AA, ISSUE C,

B) ALL DIMENSIONS ARE IN MILLIMETERS.

C) DIMENSIONS DO NOT INCLUDE MOLD

FLASH OR BURRS.

D) LANDPATTERN STANDARD: SOIC127P600X175-8M.

E) DRAWING FILENAME: M08AREV13

LAND PATTERN RECOMMENDATION

SEATING PLANE

0.10 C

C

GAGE PLANE

x 45°

DETAIL A

SCALE: 2:1

PIN ONE

INDICATOR

4

8

1

C

M

B A

0.25

B

5

A

5.60

0.65

1.75

1.27

6.20

5.80

3.81

4.00

3.80

5.00

4.80

(0.33)

1.27

0.51

0.33

0.25

0.10

1.75 MAX

0.25

0.19

0.36

0.50

0.25

R0.10

R0.10

0.90

0.406

(1.04)

OPTION A - BEVEL EDGE

OPTION B - NO BEVEL EDGE

Figure 12. SOIC-8 Package

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in any manner without notice. Please note the revision and/or date on the drawing and contact an ON Semiconductor

representative to verify or obtain the most recent revision. Package specifications do not expand the terms of ON

Semiconductor’s worldwide terms and conditions, specifically the warranty therein, which covers ON Semiconductor

products.