M24C16-RBN3TGSLASHW datasheet(13/29 Pages) STMICROELECTRONICS

13 / 29 page

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M24C16, M24C08, M24C04, M24C02, M24C01

MAXIMUM RATING

Stressing the device above the rating listed in the

Absolute Maximum Ratings" table may cause per-

manent damage to the device. These are stress

ratings only and operation of the device at these or

any other conditions above those indicated in the

Operating sections of this specification is not im-

plied. Exposure to Absolute Maximum Rating con-

ditions for extended periods may affect device

reliability. Refer also to the STMicroelectronics

SURE Program and other relevant quality docu-

ments.

Table 4. Absolute Maximum Ratings

Note: 1. Compliant with JEDEC Std J-STD-020B (for small body, Sn-Pb or Pb assembly), the ST ECOPACK® 7191395 specification, and

the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU

2. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500

Ω, R2=500 Ω)

Symbol

Parameter

Min.

Max.

Unit

TSTG

Storage Temperature

–65

150

°C

TLEAD

Lead Temperature during Soldering

See note 1

°C

VIO

Input or Output range

–0.50

6.5

VCC

Supply Voltage

–0.50

6.5

VESD

Electrostatic Discharge Voltage (Human Body model) 2

–4000

4000

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