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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LSP476 데이터시트(PDF) 12 Page - OSRAM GmbH |
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LSP476 데이터시트(HTML) 12 Page - OSRAM GmbH |
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12 / 21 page  2015-01-19 12 Version 1.0 LS P476 Note: The upper solder pad layout represents the recommended solder pad for top mounting. For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Anm.: Das obere Lötpaddesign zeigt das empfohlene Lötpad für die Montage von oben. Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- Stickstoffatmosphäre zu löten. Das Gehäuse ist für Ultraschallreinigung nicht geeignet. |
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