ST72F324J datasheet(150/156 Pages) STMICROELECTRONICS

150 / 156 page

ST72324J/K

150/156

ST72324J/K DEVICE CONFIGURATION AND ORDERING INFORMATION (Cont’d)

14.2 DEVICE ORDERING INFORMATION AND TRANSFER OF CUSTOMER CODE

Customer code is made up of the ROM contents

and the list of the selected options (if any). The

ROM contents are to be sent on diskette, or by

electronic means, with the S19 hexadecimal file

generated by the development tool. All unused

bytes must be set to FFh.

The

selected

options

are

communicated

STMicroelectronics using the correctly completed

OPTION LIST appended.

The STMicroelectronics Sales Organization will be

pleased to provide detailed information on con-

tractual points.

Figure 104. ROM Factory Coded Device Types

Table 25. Orderable Flash Device Types

Part Number

Program

Memory

(Bytes)

Temp. Range

Package

ST72F324J6T6

32KB FLASH

-40°C +85°C

TQFP44

ST72F324J4T6

16KB FLASH

ST72F324J2T6

8KB FLASH

ST72F324J6B6

32KB FLASH

SDIP42

ST72F324J4B6

16KB FLASH

ST72F324J2B6

8KB FLASH

ST72F324J6TC

32KB FLASH

-40°C +125°C

TQFP44

ST72F324K6T6

32KB FLASH

-40°C +85°C

TQFP32

ST72F324K4T6

16KB FLASH

ST72F324K2T6

8KB FLASH

ST72F324K6B6

32KB FLASH

SDIP32

ST72F324K4B6

16KB FLASH

ST72F324K2B6

8KB FLASH

ST72F324K6TC

32KB FLASH

-40°C +125°C

TQFP32

DEVICE PACKAGE

TEMP.

RANGE

XXX

Code name (defined by STMicroelectronics)

1= 0 to +70 °C

5= -10 to +85 °C

6= -40 to +85 °C

C = -40 to +125 °C

T= Plastic Thin Quad Flat Pack

B= Plastic Dual in Line

ST72324J6, ST72324J4, ST72324J2

ST72324K6, ST72324K4, ST72324K2

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