FEATURES
* Thermal conductivity: 1.5W/m.k
* Low pressure applications
* Natural tack
* Electrical insulating
* High temperature resistance
* 100 % Lead (Pb)-free and RoHS Compliant

DESCRIPTION
ATCR1R5 series thermal pad is a special compound formed
by mixing the silicon gel flour and the ceramic flour. This
pad has natural weak adhesion on both sides and presents
good thermal conductivity and electrical insulation under low
pressure. ATCR1R5 series can work stably at
-40～150ºC. The flame rating is UL94 V0.
With good thermal conductivity, wide temperature range and
low price, this pad could be a cost-effective one.