DCFeatures
• ACEPACK 2 power module
– 13 mΩ of typical RDS(on) each switch (2 dice in parallel per switch)
– 2.5 kVrms insulation voltage
– Integrated NTC temperature sensor
– DC link capacitors between DC BUS and neutral
– AIN DBC improved thermal performance
– Press fit contact pins

Description
This ACEPACK 2 power module represents a leg of a T-type 3-level inverter
topology that integrates the advanced silicon carbide power MOSFET technology
from STMicroelectronics. This module is manufactured using both the innovative
properties of the wide bandgap materials and the high thermal performance
substrate, which results in exceptional low on-resistance per unit area and excellent
switching performance almost independent of temperature. A negative temperature
sensor and three DC link capacitors are also included to optimize switching behavior.

Applications
• High frequency converters