FI_10 pdf, FI_10 상세설명, FI_10 데이터시트, FI

부품명	FI

상세설명	1.27 mm contact pitch contributes to downsizing of electrical devices.

파일 크기	1159.31 Kbytes

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제조업체	HIROSE [Hirose Electric]

홈페이지	http://www.hirose-connectors.com

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유사한 부품 번호 - FI_10

제조업체	부품명	데이터시트	상세설명
List of Unclassifed Man...	FI-1000-100	39Kb / 1P	DC AMMETER SHUNTS DERIVADORES DE CORRIENTE (SHUNTS)
List of Unclassifed Man...	FI-1000-50	39Kb / 1P	DC AMMETER SHUNTS DERIVADORES DE CORRIENTE (SHUNTS)
Fairchild Semiconductor	FIN1001	618Kb / 7P	3.3V LVDS 1-Bit High Speed Differential Driver
Fairchild Semiconductor	FIN1001	616Kb / 7P	3.3V LVDS 1-Bit High Speed Differential Driver
ON Semiconductor	FIN1001	737Kb / 11P	3.3V LVDS 1-Bit High-Speed Differential Driver March 2017 Rev. 1.4

제조업체	부품명	데이터시트	상세설명
Panasonic Semiconductor	AXE510124	321Kb / 6P	The 2.5 mm wide ultra-slim body contributes to further contributes to further enhancement of target equipment.
Omron Electronics LLC	E39-RSB	2Mb / 21P	Photoelectric Sensor with Built-in Amplifier Contributes to Equipment Downsizing
HOKURIKU ELECTRIC INDUS...	HAP-BME-20-13N01	362Kb / 1P	Industry-thinnest contributes miniaturization of application
Lumberg	302299	443Kb / 4P	Micromodul connectors, pitch 1.27 mm
	AZ30	311Kb / 3P	Micromodul connectors, pitch 1.27 mm
	MICAL	738Kb / 3P	Micromodul connectors, pitch 1.27 mm
	MICALD	769Kb / 3P	Micromodul connectors, pitch 1.27 mm
	MICS	453Kb / 4P	Micromodul connectors, pitch 1.27 mm
	MICAVP3	645Kb / 4P	Micromodul connectors, pitch 1.27 mm
ALPS ELECTRIC CO.,LTD.	SKTA	354Kb / 3P	1.6mm width contributes to thinner devices