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부품명	WLCSP

상세설명	Wafer Level Processing and Die Processing Services

파일 크기	474.49 Kbytes

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제조업체	AMKOR [Amkor Technology]

홈페이지	http://www.amkor.com

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유사한 부품 번호 - WLCSP

제조업체	부품명	데이터시트	상세설명
Amkor Technology	WLCSP+	1Mb / 5P	Wafer level packaging applies similar processes as used in front-end wafer processing. 01/22
Amkor Technology	WLCSP-V01	813Kb / 3P	Wafer Level Processing & Die Processing Services (WLP/DPS) 01/22
Global Mixed-mode Techn...	WLCSP11X12-132	165Kb / 1P	Package Outline
Global Mixed-mode Techn...	WLCSP15X15-163	173Kb / 1P	Package Outline
NXP Semiconductors	WLCSP16	255Kb / 38P	32-bit ARM Cortex-M0 microcontroller; 32 kB flash and 8 kB SRAM Rev. 00.04-23 June 2010

제조업체	부품명	데이터시트	상세설명
STMicroelectronics	IMSA110	354Kb / 26P	IMAGE AND SIGNAL PROCESSING SUB.SYSTEM Jul-1992
ATMEL Corporation	ATSAM3308B	358Kb / 27P	Audio Processing
	ATSAM3108B	309Kb / 23P	Audio Processing
	ATSAM3703	444Kb / 36P	Audio Processing
	ATSAM2195	1Mb / 19P	Audio Processing
	ATSAM2533	506Kb / 19P	Audio Processing
Texas Instruments	TMS320F28069	2Mb / 177P	Fast Interrupt Response and Processing
Intersil Corporation	ISL22326WM	103Kb / 3P	Full Homogeneous Lot Processing in Wafer Fab November 11, 2011
ADL Embedded Solutions	ADLQM67PC-3517UE	346Kb / 4P	Radar and sonar processing
ADL Embedded Solutions	ADLQM87HD	573Kb / 4P	Radar and sonar processing