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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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ATECC508A 데이터시트(PDF) 101 Page - Microchip Technology |
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ATECC508A 데이터시트(HTML) 101 Page - Microchip Technology |
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101 / 109 page  RECOMMENDED LAND PATTERN Dimension Limits Units Optional Center Pad Width Optional Center Pad Length Contact Pitch Y2 X2 1.40 1.60 MILLIMETERS 0.50 BSC MIN E MAX Contact Pad Length (X8) Contact Pad Width (X8) Y1 X1 0.85 0.30 NOM 1 2 8 C Contact Pad Spacing 2.90 Contact Pad to Center Pad (X8) G1 0.20 Thermal Via Diameter V Thermal Via Pitch EV 0.30 1.00 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: © 2017 Microchip Technology Inc. Microchip Technology Drawing C04-21355-Q4B Rev A 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package X2 Y2 Y1 SILK SCREEN X1 E C EV G2 G1 ØV Contact Pad to Contact Pad (X6) G2 0.33 ATECC508A Package Drawings © 2017 Microchip Technology Inc. Datasheet Complete DS20005927A-page 101 |
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