TPS54873

SLVS444 – OCTOBER 2002

www.ti.com

10

Connect Pin 1 to Analog Ground Plane

in This Area for Optimum Performance

Minimum Recommended Top

Side Analog Ground Area

0.3478

0.0150

0.06

0.0256

0.1700

0.1340

0.0630

0.0400

Ø 0.0180

4 PL

0.2090

Ø 0.0130

8 PL

Minimum Recommended Exposed

Copper Area for Powerpad. 5-mm

Stencils May Require 10 Percent

Larger Area

0.0650

0.0500

0.0500

0.0650

0.0339

0.0339

0.0500

Minimum Recommended Thermal Vias: 8 x 0.013 Diameter Inside

Powerpad Area 4 x 0.018 Diameter Under Device as Shown.

Additional 0.018 Diameter Vias May Be Used if Top Side Analog Ground

Area Is Extended.

0.3820

Figure 10. Recommended Land Pattern for 28-Pin PWP PowerPAD

PERFORMANCE GRAPHS

Figure 11

50

55

60

65

70

75

80

85

90

95

100

01

2

3

45

6

7

89

VI = 5 V,

VO = 3.3 V

EFFICIENCY

vs

OUTPUT CURRENT

IO – Output Current – A

Figure 12

3.28

3.285

3.29

3.295

3.3

3.305

3.31

3.315

3.32

0

1

2

34

56

78

9

OUTPUT VOLTAGE

vs

OUTPUT CURRENT

IO – Output Current – A

Figure 13

3.28

3.285

3.29

3.295

3.3

3.305

3.31

3.315

3.32

4

4.5

5

5.5

6

IO = 0

IO = 8

IO = 4

VI – Input Voltage – V

OUTPUT VOLTAGE

vs

INPUT VOLTAGE