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LT3045 데이터시트(PDF) 33 Page - Linear Technology |
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LT3045 데이터시트(HTML) 33 Page - Linear Technology |
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33 / 36 page ![]() LT3045-1 33 30451fa For more information www.linear.com/LT3045-1 PACKAGE DESCRIPTION Please refer to http://www.linear.com/product/LT3045-1#packaging for the most recent package drawings. 3.00 ±0.10 (4 SIDES) NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD AND TIE BARS SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 0.40 ±0.10 BOTTOM VIEW—EXPOSED PAD 1.65 ±0.10 0.75 ±0.05 R = 0.115 TYP 1 6 12 7 PIN 1 TOP MARK (SEE NOTE 6) 0.200 REF 0.00 – 0.05 (DD12) DFN 0106 REV A RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 0.23 ±0.05 0.25 ±0.05 2.25 REF 2.38 ±0.05 1.65 ±0.05 2.10 ±0.05 0.70 ±0.05 3.50 ±0.05 PACKAGE OUTLINE PIN 1 NOTCH R = 0.20 OR 0.25 × 45° CHAMFER 2.38 ±0.10 2.25 REF 0.45 BSC 0.45 BSC DD Package 12-Lead Plastic DFN (3mm × 3mm) (Reference LTC DWG # 05-08-1725 Rev A) |
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