MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1

Freescale Semiconductor

11

Electrical and Thermal Characteristics

Table 6 provides the DC electrical characteristics for the MPC755.

Table 5. Thermal Sensor Specifications

At recommended operating conditions (see Table 3)

Characteristic

Min

Max

Unit

Notes

Temperature range

0

127

°C

1

Comparator settling time

20

—

µs

2, 3

Resolution

4

—

°C

3

Accuracy

–12

+12

°C

3

Notes:

1. The temperature is the junction temperature of the die. The thermal assist unit’s raw output does not indicate an absolute temperature, but

must be interpreted by software to derive the absolute junction temperature. For information about the use and calibration of the TAU, see

Freescale Application Note AN1800/D, Programming the Thermal Assist Unit in the MPC750 Microprocessor.

2. The comparator settling time value must be converted into the number of CPU clocks that need to be written into the THRM3 SPR.

3. Guaranteed by design and characterization.

Table 6. DC Electrical Specifications

At recommended operating conditions (see Table 3)

Characteristic

Nominal

Bus Voltage

1

Symbol

Min

Max

Unit

Notes

Input high voltage (all inputs except SYSCLK)

2.5

1.6

V

2, 3

3.3

2.0

V

2, 3

Input low voltage (all inputs except SYSCLK)

2.5

–0.3

0.6

V

2

3.3

–0.3

0.8

V

SYSCLK input high voltage

2.5

1.8

V

3.3

2.4

V

SYSCLK input low voltage

2.5

–0.3

0.4

V

3.3

–0.3

0.4

V

Input leakage current,

—10

µA

2, 3

High-Z (off-state) leakage current,

—10

µA

2, 3, 5

2.5

1.7

—

V

3.3

2.4

—

V

2.5

—0.45

V

3.3

—0.4

V