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AS39513 데이터시트(PDF) 4 Page - ams AG |
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AS39513 데이터시트(HTML) 4 Page - ams AG |
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4 / 108 page ![]() Page 4 ams Datasheet Document Feedback [v1-10] 2018-Apr-25 AS39513 − Pin and Pad Layout The AS39513 can be shipped as bare die with gold bumps. When packaged as a bare die, the pad arrangement is as depicted below (measures are reported in μm). Figure 3: Bare Die with Gold Bumps Pinout Note(s): 1. Bondpad spacing is ≥ 400 μm Pin Description Figure 4: Pin Description of AS39513 with Gold Bumps Pin Name Pin Type Description SCLK I SPI CLK input DOUT O Digital data output. SEXT I Analog input for external sensor. VBAT S Battery input. DIN I Digital data input. VSS S Negative supply and ground. ATEST O Analog test output. VEXT O Power output for external circuit, generated by RF field. CE I SPI enable input. Note this is active high. Pin and Pad Layout VBAT ATEST VEXT X = 125.6, Y = 1640.2 X = 124.7, Y = 1139.8 X = 124.7, Y = 501.7 VSS DIN X = 2232.5, Y = 2135.7 X = 2233.4, Y = 1598.6 IC: X = 2358.0, Y = 2268.0 AS39513 |
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