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S29CD032G 데이터시트(PDF) 90 Page - SPANSION

부품명 S29CD032G
상세설명  CMOS 2.5 VOLT ONLY BURST MODE DUAL BOOT, SIMULTANEOUS READ /WRITE FLASH MEMORY
PDF  93 Pages
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제조업체  SPANSION [SPANSION]
홈페이지  http://www.spansion.com
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S29CD032G 데이터시트(HTML) 90 Page - SPANSION

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S29CD032G
30606B0 March 22, 2004
Ad va n c e
In f o rm a t i o n
Physical Dimensions
LAA080–80-ball Fortified Ball Grid Array (13 x 11 mm)
3214\38.12C
PACKAGE
LAA 080
JEDEC
N/A
13.00 x 11.00 mm
NOTE
PACKAGE
SYMBOL
MIN
NOM
MAX
A
--
--
1.40
PROFILE HEIGHT
A1
0.40
--
--
STANDOFF
A2
0.60
--
--
BODY THICKNESS
D
13.00 BSC.
BODY SIZE
E
11.00 BSC.
BODY SIZE
D1
9.00 BSC.
MATRIX FOOTPRINT
E1
7.00 BSC.
MATRIX FOOTPRINT
MD
10
MATRIX SIZE D DIRECTION
ME
8
MATRIX SIZE E DIRECTION
N
80
BALL COUNT
φb
0.50
0.60
0.70
BALL DIAMETER
eD
1.00 BSC.
BALL PITCH - D DIRECTION
eE
1.00 BSC.
BALL PITCH - E DIRECTION
SD/SE
0.50 BSC
SOLDER BALL PLACEMENT
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010
(EXCEPT AS NOTED).
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE "D"
DIRECTION. SYMBOL "ME" IS THE BALL COLUMN MATRIX
SIZE IN THE "E" DIRECTION. N IS THE TOTAL NUMBER OF
SOLDER BALLS.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER
OF SOLDER BALLS IN THE OUTER ROW PARALLEL TO THE D
OR E DIMENSION, RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW , SD OR SE = e/2
8.
N/A
9.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
BOTTOM VIEW
SIDE VIEW
TOP VIEW
2X
2X
C
0.20
C
0.20
6
7
7
A
C
C
φ0.10
φ0.25 M
M
B
C
0.25
0.15 C
A
B
C
SEATING PLANE
J
K
eD
(INK OR LASER)
CORNER
A1
A2
D
E
A1 CORNER ID.
1.00±0.5
A
A1
CORNER
A1
NX
φb
SD
SE
eE
E1
D1
1
2
3
4
5
6
7
8
A
CB
D
FE
G
H



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