42

SLDM-06D1Ax

tech.support@psbel.com

belpowersolutions.com

56. THERMAL CONSIDERATIONS

Power modules operate in a variety of thermal environments; however, sufficient cooling should always be provided to help ensure reliable

operation.

Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the

operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements

taken in a wind tunnel. The test set-up is shown in Figure 49. The preferred airflow direction for the module is in Figure 50.

Figure 49

Thermal Test Setup

The thermal reference points, Tref used in the specifications are also shown in Figure 50. For reliable operation the temperatures at these points

should not exceed 130oC at L1 and 125°C at Q3. The output power of the module should not exceed the rated power of the module (Vo,set x

Io,max).

Please refer to the Application Note “Thermal Characterization Process For Open-Frame Board-Mounted Power Modules” for a detailed

discussion of thermal aspects including maximum device temperatures.

Figure 50

Preferred airflow direction and location of hot-spot of the module (Tref).

Air

flow

x

Power Module

Wind Tunnel

PWBs

12.7_

(0.50)

76.2_

(3.0)

Probe Location

for measuring

airflow and

ambient

temperature

25.4_

(1.0)