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FUSB301 데이터시트(PDF) 2 Page - ON Semiconductor |
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FUSB301 데이터시트(HTML) 2 Page - ON Semiconductor |
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2 / 14 page ![]() FUSB301 www.onsemi.com 2 ORDERING INFORMATION Part Number Top Mark Operating Temperature Range Package Packing Method† FUSB301TMX NU −40 to 85°C 10−Lead Ultra−thin Molded Leadless Package (TMLP) 1.6 mm × 1.2 mm × 0.375 mm Tape and Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. BLOCK DIAGRAM Figure 2. Block Diagram PIN CONFIGURATION Figure 3. Pin Assignment (Top Through View) |
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