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AD5693RARMZ 데이터시트(PDF) 5 Page - Analog Devices

부품명 AD5693RARMZ
상세설명  Tiny 16-/14-/12-Bit I2C nanoDAC
PDF  26 Pages
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제조업체  AD [Analog Devices]
홈페이지  http://www.analog.com
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AD5693RARMZ 데이터시트(HTML) 5 Page - Analog Devices

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Data Sheet
AD5693R/AD5692R/AD5691R/AD5693
Rev. D | Page 5 of 26
AC CHARACTERISTICS
VDD = 2.7 V to 5.5 V, RL = 2 kΩ to GND, CL = 200 pF to GND, VREF = 2.5 V to VDD − 0.2 V, VLOGIC = 1.62 V to 5.5 V, −40°C < TA < +105°C,
typical at 25°C, unless otherwise noted.
Table 3.
Parameter
Typ
Max
Unit
Conditions/Comments
Output Voltage Settling Time1, 2
5
7
µs
Gain = 1
Slew Rate
0.7
V/µs
Digital-to-Analog Glitch Impulse1
0.1
nV-s
±1 LSB change around major carry, gain = 2
Digital Feedthrough1
0.1
nV-s
Total Harmonic Distortion1
−80
dB
At ambient temperature, BW = 20 kHz, VDD = 5 V, fOUT = 1 kHz
Output Noise Spectral Density1
300
nV/√Hz
DAC code = midscale, 10 kHz
Output Noise
6
µV p-p
0.1 Hz to 10 Hz; internal reference
SNR
90
dB
At ambient temperature, bandwidth (BW) = 20 kHz, VDD =5 V, fOUT = 1 kHz
SFDR
83
dB
At ambient temperature, BW = 20 kHz, VDD =5 V, fOUT = 1 kHz
SINAD
80
dB
At ambient temperature, BW = 20 kHz, VDD =5 V, fOUT = 1 kHz
1
See the Terminology section.
2
For the AD5693R/AD5693, to ±2 LSB. For the AD5692R, to ±1 LSB. For the AD5691R, to ±0.5 LSB
TIMING CHARACTERISTICS
VDD = 2.7 V to 5.5 V, VLOGIC = 1.62 V to 5.5 V, −40°C < TA < +105°C, unless otherwise noted.
Table 4.
Parameter1
Min
Typ
Max
Unit
Description
fSCL2
400
kHz
Serial clock frequency
t1
0.6
µs
SCL high time, tHIGH
t2
1.3
µs
SCL low time, tLOW
t3
100
ns
Data setup time, tSU; DAT
t43
0
0.9
µs
Data hold time, tHD; DAT
t5
0.6
µs
Setup time for a repeated start condition, tSU; STA
t6
0.6
µs
Hold time (repeated) start condition, tHD; STA
t7
1.3
µs
Bus free time between a stop and a start condition, tBUF
t8
0.6
µs
Setup time for a stop condition, tSU; STO
t9
20
300
ns
Rise time of SDA signal, tr
t104
20 × (VDD/5.5 V)
300
ns
Fall time of SDA signal, tf
t11
20
300
ns
Rise time of SCL signal, tr
t124
20 × (VDD/5.5 V)
300
ns
Fall time of SCL signal, tf
tSP5
0
50
ns
Pulse width of suppressed spike (not shown in Figure 3)
t13
400
ns
LDAC falling edge to SCL falling edge
t14
400
ns
LDAC pulse width (synchronous mode)
t15
20
ns
LDAC pulse width (asynchronous mode)
t16
75
ns
RESET pulse width
tREF_POWER_UP6
600
µs
Reference power-up (not shown in Figure 3)
tSHUTDOWN7
6
µs
Exit shutdown (not shown in Figure 3)
1
Maximum bus capacitance is limited to 400 pF. All input signals are specified with tR = tF = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
2
The SDA and SCL timing is measured with the input filters enabled. Switching off the input filters improves the transfer rate; however, it has a negative effect on the
EMC behavior of the device.
3
The master should add at least 300 ns for the SDA signal (with respect to the VOH (min) of the SCL signal) to bridge the undefined region of the falling edge of SCL.
4
Substitute VLOGIC for VDD on devices that include a VLOGIC pin.
5
Not applicable for standard mode.
6
Expect the same timing when powering up the device after VDD is equal to 2.7 V.
7
Time to exit power-down to normal mode of AD5693R/AD5692R/AD5691R/AD5693 operation.



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