Datasheet

BMP280 Digital Pressure Sensor

Page 42

BST-BMP280-DS001-19 | Revision 1.19 | January 2018

Bosch Sensortec

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parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.

Note: Specifications within this document are subject to change without notice. Not intended for publication.

7.4 Soldering guidelines

The moisture sensitivity level of the BMP280 sensors corresponds to JEDEC Level 1, see also:

 IPC/JEDEC J-STD-020C “Joint Industry Standard: Moisture/Reflow Sensitivity

Classification for non-hermetic Solid State Surface Mount Devices”

 IPC/JEDEC J-STD-033A “Joint Industry Standard: Handling, Packing, Shipping and Use of

Moisture/Reflow Sensitive Surface Mount Devices”.

The sensor fulfils the lead-free soldering requirements of the above-mentioned IPC/JEDEC

standard, i.e. reflow soldering with a peak temperature up to 260°C. The minimum height of the

solder after reflow shall be at least 50µm. This is required for good mechanical decoupling

between the sensor device and the printed circuit board (PCB).

Figure 20: Soldering profile