MA6002 datasheet(8/9 Pages) MPOWER

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MA6002

Major Power Technology Co., Ltd.

Rev.1.1

Aug.28, 2015

junction temperature of the die and TA is the ambient temperature. The junction to ambient

thermal resistance

θJA is layout dependent. For TDFN-10L (3x3) packages, the thermal

resistance

θJA is 60°C/W on the 1 in2 Multi-layer PCB copper area (The IC exposed pad

must be connected to the PCB Copper area) two-layers thermal test board. The maximum

power dissipation at TA = 25°C can be calculated by following formula:

PD(MAX) = (125°C - 25°C) / (45°C/W) = 2.2W for TDFN-10L (3x3) package

The maximum power dissipation depends on operating ambient temperature for fixed

TJ(MAX) and thermal resistance

θJA.

Layout Guide

1. Input Capacitors (C1, C2) are necessarily closed to IC.

2. Feedback low-side resistor’s (R2, R4) ground trace close to input capacitor’s ground trace.

3. All power trace is wide and short.

4. Feedback trace must keep inductor’s trace away

EN1

FB2

110

FB1

VIN2

GND2

VIN1

GND1

SW1

Exposed

Pad

EN2

SW2

Via to VIN1

Via to VIN2

VOUT1

VOUT2

GND

MA6002 데이터시트(PDF) 8 Page - Major-Power Technology Co., LTD.