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MA6002

Major Power Technology Co., Ltd.

Rev.1.1

Aug.28, 2015



BLOCK DIAGRAM

FB1

EN1

VIN1

LX1

GND1

Over-Temperature and

Short-Circuit Protection

FB

Soft-Star

0.6V

+

-

-

+

Icomp

Isense

AMP

OSC

SLOPE

COMP

PWM

LOGIC

NON-OVERLAP

CONTROL

RESET

SET

Enable Logic

FB2

EN2

VIN2

LX2

GND2

Over-Temperature and

Short-Circuit Protection

FB

Soft-Star

0.6V

+

-

-

+

Icomp

Isense

AMP

OSC

SLOPE

COMP

PWM

LOGIC

NON-OVERLAP

CONTROL

RESET

SET

Enable Logic

The package of MA6002 is TDFN-10L (3×3); the pin assignment is given by:

1

10

2

3

4

5

6

7

8

9

Name

Description

VIN2

Power Input of Channel 2.

LX2

Pin for Switching of Channel 2.

GND1,2

Ground. The exposed pad must be

soldered to a large PCB and connected to

GND for maximum power dissipation.

FB1

Feedback of Channel 1.

EN1

Chip Enable of Channel 1 (Active High).

VEN1 ≦ VIN1.

VIN1

Power Input of Channel 1.

LX1

Pin for Switching of Channel 1.

FB2

Feedback of Channel 2.

EN2

Chip Enable of Channel 2 (Active High).

VEN2 ≦ VIN2.