Dual DMOS Full-Bridge Motor Driver

AMT49702

9

Allegro MicroSystems, LLC

955 Perimeter Road

Manchester, NH 03103-3353 U.S.A.

www.allegromicro.com

Figure 2: 16-lead TSSOP package (Suffix LP)

A

1.20 MAX

0.15

0.00

0.30

0.19

0.20

0.09

8º

0º

0.60 ±0.15

1.00 REF

C

SEATING

PLANE

C

0.10

16X

0.65 BSC

0.25 BSC

2

1

16

5.00 ±0.10

4.40 ±0.10

6.40 ±0.20

GAUGE PLANE

SEATING PLANE

A

B

B

C

D

Exposed thermal pad (bottom surface); dimensions may vary with device

6.10

0.65

0.45

1.70

3.00

3.00

16

2

1

1

C

D

Branded Face

3 NOM

3 NOM

For Reference Only – Not for Tooling Use

(Reference MO-153 ABT)

Dimensions in millimeters. NOT TO SCALE

Dimensions exclusive of mold flash, gate burrs, and dambar protrusions

Exact case and lead configuration at supplier discretion within limits shown

PCB Layout Reference View

Terminal #1 mark area

Reference land pattern layout (reference IPC7351 SOP65P640X110-17M);

All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary

to meet application process requirements and PCB layout tolerances; when

mounting on a multilayer PCB, thermal vias at the exposed thermal pad land

can improve thermal dissipation (reference EIA/JEDEC Standard JESD51-5)

Branding scale and appearance at supplier discretion

Standard Branding Reference View

YYWW

NNNNNNN

LLLL

= Device part number

= Supplier emblem

= Last two digits of year of manufacture

= Week of manufacture

= Characters 5-8 of lot number

N

Y

W

L

PACKAGE OUTLINE DRAWING