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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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GD25S512MDBJS 데이터시트(PDF) 7 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD25S512MDBJS 데이터시트(HTML) 7 Page - GigaDevice Semiconductor (Beijing) Inc. |
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7 / 87 page  3.3V Uniform Sector Dual and Quad Serial Flash GD25S512MD 7 Serial MCP Device Configuration Figure 2 GD25S512MD Device configuration Die 1# Die 0# GD25B256D GD25S512MD GD25B256D CS# SCLK RESET# (1) IO0 IO1 IO2 IO3 Note: 1. RESET# pin is available on SOP16 and TFBGA packages All signal pins are shared by the stacked dies within the package. Each die is assigned a “Die ID#” in the factory. Only a single die is active at any given time, and have the control of SPI bus to communicate with the external SPI controller. However, all the dies will accept two instructions regardle ss their Active or Idle status: a) “Software Die Select (C2H)” instruction: it is used to set any single die to be active according to the 8- bit Die ID following the instruction. b) “Software Reset (66H+99H)” instruction: it is used to reset all the stacked dies to the power-up state. |
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