AD9174 datasheet(15/164 Pages) AD

15 / 164 page

Data Sheet

AD9174

Rev. A | Page 15 of 164

ABSOLUTE MAXIMUM RATINGS

Table 10.

Parameter

Rating

ISET, FILT_COARSE, FILT_BYP, FILT_VCM

−0.3 V to AVDD1.8 + 0.3 V

SERDINx±

−0.2 V to SVDD1.0 + 0.2 V

SYNCOUT0±, SYNCOUT1±, RESET,

TXEN0, TXEN1, IRQ0, IRQ1, CS,

SCLK, SDIO, SDO

−0.3 V to DVDD1.8 + 0.3 V

DAC0±, DAC1±, CLKIN±, CLKOUT±,

FILT_FINE

−0.2 V to AVDD1.0 + 0.2 V

SYSREF±

−0.2 V to DVDD1.0 + 0.2 V

AVDD1.0, DVDD1.0, SVDD1.0 to GND

−0.2 V to +1.2 V

AVDD1.8, DVDD1.8 to GND

−0.3 V to 2.2 V

Maximum Junction Temperature (TJ)1

118°C

Storage Temperature Range

−65°C to +150°C

Reflow

260°C

Some operating modes of the device may cause the device to approach or

exceed the maximum junction temperature during operation at supported

ambient temperatures. Removal of heat from the device may require

additional measures such as active airflow, heat sinks, or other measures.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

REFLOW PROFILE

The AD9174 reflow profile is in accordance with the JEDEC

JESD20 criteria for Pb-free devices. The maximum reflow

temperature is 260°C.

THERMAL CHARACTERISTICS

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure. θJC is

the junction to case thermal resistance.

Thermal resistances and thermal characterization parameters are

specified vs. the number of PCB layers in different airflow velocities

(in m/sec). The use of appropriate thermal management tech-

niques is recommended to ensure that the maximum junction

temperature does not exceed the limits shown in Table 10.

Use the values in Table 11 in compliance with JEDEC 51-12.

Table 11. Simulated Thermal Resistance vs. PCB Layers1

PCB Type

Airflow

Velocity

(m/sec)

θJA

θJC_TOP

θJC_BOT

Unit

JEDEC

2s2p

Board

0.0

25.3

2.43

3.04

°C/W

1.0

22.6

N/A

°C/W

2.5

21.0

N/A

°C/W

12-Layer

PCB2

0.0

15.4

2.4

2.6

°C/W

1.0

13.1

N/A

°C/W

2.5

11.6

N/A

°C/W

N/A means not applicable.

Non JEDEC thermal resistance.

1SOP PCB with no vias in PCB.

1SOP PCB with 7 × 7 standard JEDEC vias.

ESD CAUTION

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