ADF5902 datasheet(6/39 Pages) AD

6 / 39 page

ADF5902

Data Sheet

Rev. 0 | Page 6 of 39

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

AHI to GND

−0.3 V to +3.9 V

AHI to TX_AHI

−0.3 V to +0.3 V

AHI to RF_AHI

−0.3 V to +0.3 V

AHI to VCO_AHI

−0.3 V to +0.3 V

AHI to DVDD

−0.3 V to +0.3 V

AHI to CP_AHI

−0.3 V to +0.3 V

VTUNE to GND

−0.3 V to +3.6 V

Digital Input/Output Voltage to GND

−0.3 V to DVDD + 0.3 V

Operating Temperature Range

−40°C to +105°C

Storage Temperature Range

−65°C to +150°C

Maximum Junction Temperature

150°C

Reflow Soldering

Peak Temperature

260°C

Time at Peak Temperature

40 sec

Electrostatic Discharge (ESD)

Charged Device Model (CDM)

250 V

Human Body Model (HBM)

2000 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

The ADF5902 is a high performance RF integrated circuit with

an ESD rating of 2 kV and is ESD sensitive. Take proper

precautions for handling and assembly.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Table 4. Thermal Resistance

Package Type

θJA1

θJC2

Unit

CP-32-123

48.18

26.86

°C/W

1 θJA is the natural convection junction-to-ambient thermal resistance

measured in a one cubic foot sealed enclosure.

2 θJC is the junction-to-case thermal resistance.

3 Test Condition 1: thermal impedance simulated values are based on use of a

PCB with the thermal impedance pad soldered to GND.

ESD CAUTION

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