12 / 14 page
NX26F011A
NX26F041A
12
NexFlash Technologies, Inc.
PRELIMINARY NXSF009A-0599
05/05/99 ©
PACKAGE INFORMATION
Plastic TSOP - 28-pin
Package Code: V (Type I)
Notes:
1. Controlling dimension: millimeters, unless
otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold
flash protrusions and should be measured
from the bottom of the package.
4. Formed leads shall be planar with respect
to one another within 0.004 inches at the
seating plane.
Plastic TSOP (T—Type I)
Millimeters
Inches
Symbol
Min
Max
Min
Max
Ref. Std.
No. Leads
28
A
1.00
1.20
0.039
0.047
A1
0.05
0.20
0.002
0.008
B
0.15
0.25
0.006
0.010
C
0.10
0.20
0.004
0.008
D
7.90
8.10
0.311
0.319
E
11.60
11.80
0.457
0.465
H
13.30
13.50
0.524
0.531
e
0.55 BSC
0.022 BSC
L
0.50
0.70
0.020
0.028
α
0°
5°
0°
5°
D
SEATING PLANE
B
e
C
1
E
A1
H
L
α
N
A
Korean ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
