74LVC2G66 datasheet(1/9 Pages) SS

부품명	74LVC2G66

상세설명	Low Voltage CMOS Logic

PDF	9 Pages

Scroll/Zoom	100%

제조업체	SS [Silicon Supplies]

홈페이지	https://siliconsupplies.com/

Logo

1 / 9 page

Low Voltage CMOS Logic – 74LVC2G66

Dual SPST Bilateral Analog Switch in bare die form

Rev 1.0

29/06/19

Description

Features:

Wide supply voltage: VCC 1.65V - 5.5V

The 74LVC2G66 Dual Single-Pole Single-Throw Analog

Switch is produced using an optimised low voltage

CMOS process. Each switch consists of two

input/output pins and an active HIGH enable input pin

(OE). A LOW signal on the enable pin (OE) turns the

analog switch off. Schmitt trigger action on the enable

inputs provides circuit tolerance for slow input rise and

fall times. Both analog and digital signals are supported

in both directions across the full VCC range. The device

is suited for multiplexing in analog-to-digital or digital-to-

analog conversion and also finds use in signal gating,

chopping or modulation/de-modulation applications.

Very low rON : 6Ω Typ, VCC = 4.5V

High speed: tpd 0.8ns Max, VCC = 3.3V

Switch current capability: 32mA

TTL input compatibility (VCC = 3.3V)

Enable inputs accept up to 5.5V

Rail-to-Rail Input / Output

High noise immunity

Tiny Die size.

Die Dimensions in µm (mils)

Ordering Information

The following part suffixes apply:

No suffix - MIL-STD-883 /2010B Visual Inspection

720 (28)

“H” - MIL-STD-883 /2010B Visual Inspection

+ MIL-PRF-38534 Class H LAT

“K” - MIL-STD-883 /2010A Visual Inspection (Space)

+ MIL-PRF-38534 Class K LAT

LAT = Lot Acceptance Test.

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

Supply Formats:

Mechanical Specification

Default – Die in Waffle Pack (400 per tray capacity)

Die Size (Unsawn)

720 x 540

28 x 21

µm

mils

Minimum Bond Pad Size

70 x 70

Sawn Wafer on Tape – On request

µm

2.76 x 2.76

mils

Die Thickness

280 (±20)

Unsawn Wafer – On request

Die Thickness <> 280µm(11 Mils) – On request

Assembled into Ceramic Package – On request

µm

11.02 (±0.79)

mils

Top Metal Composition

Al-Si-Cu 3 µm

Back Metal Composition

N/A – Bare Si

Page 1 of 9

www.siliconsupplies.com

유사한 부품 번호 - 74LVC2G66

제조업체	부품명	데이터시트	상세설명
NXP Semiconductors	74LVC2G66	144Kb / 22P	Bilateral switch Rev. 01-29 June 2004
	74LVC2G66	134Kb / 23P	Bilateral switch Rev. 02-28 August 2007
	74LVC2G66	147Kb / 24P	Bilateral switch Rev. 04-1 July 2008
Nexperia B.V. All right...	74LVC2G66	326Kb / 22P	Bilateral switch Rev. 13 - 9 September 2022
Nexperia B.V. All right...	74LVC2G66-Q100	287Kb / 20P	Bilateral switch

More results

유사한 설명 - 74LVC2G66

제조업체	부품명	데이터시트	상세설명
Silicon Supplies	CD4001B	522Kb / 4P	CMOS High Voltage Logic
	CD4011B	519Kb / 4P	CMOS High Voltage Logic
	LM137	2Mb / 6P	CMOS High Voltage Logic
	54LVC1G04	518Kb / 6P	Low Voltage CMOS Logic
	54LVC1G125	490Kb / 8P	Low Voltage CMOS Logic
	74LVC1G04	517Kb / 6P	Low Voltage CMOS Logic
	74LVC1G125	489Kb / 8P	Low Voltage CMOS Logic
	54LVC2G66	483Kb / 9P	Low Voltage CMOS Logic
	54LVC1GU04	1Mb / 7P	Low Voltage CMOS Logic
	74LVC1GU04	1Mb / 7P	Low Voltage CMOS Logic

More results

74LVC2G66 데이터시트(PDF) 1 Page - Silicon Supplies

74LVC2G66 데이터시트(HTML) 1 Page - Silicon Supplies

유사한 부품 번호 - 74LVC2G66

유사한 설명 - 74LVC2G66

Html Pages

1 2 3 4 5 6 7 8 9

데이터시트 다운로드

링크 URL