MGSF2P02HD

http://onsemi.com

2

Rating

Symbol

Value

Unit

Drain−to−Source Voltage

20

V

20

V

Gate−to−Source Voltage

±9

V

Drain Current − Continuous

Thermal Resistance − Junction to Ambient (Note 1.)

1.3

10

400

210

312

A

mW

mW

°C/W

Drain Current − Continuous

Thermal Resistance − Junction to Ambient (Note 2.)

2.9

15

2.0

1.0

62.5

A

W

W

°C/W

Operating and Storage Temperature Range

− 55 to 150

°C

160

mJ

THERMAL CHARACTERISTICS

Maximum Lead Temperature for Soldering Purposes, 1/8

″ from Case for 5 seconds

260

°C

1. Minimum FR−4 or G−10 PCB, Operating to Steady State.

2. Mounted onto a 2

″ square FR−4 Board (1″ sq. 2 oz. Cu 0.06″ thick single sided), Operating time ≤5 seconds.