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RA32E1-RUT-FR 데이터시트(PDF) 15 Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.

부품명 RA32E1-RUT-FR
상세설명  This production use the PLCC-2 package竊똮utline size 2.8*3.5*0.65mm
PDF  20 Pages
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제조업체  REFOND [SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.]
홈페이지  http://www.refond.com/
Logo REFOND - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.

RA32E1-RUT-FR 데이터시트(HTML) 15 Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.

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Tel: +86-755-66839118
Fax:+86-755-66839300
E-mail:uvsales@refond.com
W
eb: www.refonduv.com
PAGE:15
REFOND:WI-E-045
A/3
REV:E/3
TG-201709070731NP
Notes
(1)Reflow soldering should not be done more than twice. If more than 24 hours between the two solderings ,
LED will be damaged.
(2)When soldering , do not put stress on the LEDs during heating.
3.1.1 Soldering Iron
(1) When do soldering by hand, keep the temperature of iron below less 300℃ less than 3 seconds.
(2) Soldering by hand should be done only one time.
3.1.2 Repairing
Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,a double-
head soldering iron should be used (as below figure). It should be confirmed in advance whether the
characteristics of LEDs will or not be damaged by repairing.
LED
3.1.3 Cautions
(1) The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of
package. The pressure to the top surface will be impacted on the reliability of the LEDs. Precautions should be
taken to avoid the strong pressure on the encapsulated part. So when usethe picking up nozzle, the pressure on
the silicone resin should be proper. LED
(2) Components should not be mounted on warped (non coplanar) portion of PCB. After soldering, do not warp
the circuit board.LED
(3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after
soldering. Do not rapidly cool device after soldering.



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