DMOS Microstepping Driver with Translator

A3979

15

Allegro MicroSystems, Inc.

115 Northeast Cutoff, Box 15036

Worcester, Massachusetts 01615-0036 (508) 853-5000

www.allegromicro.com

LP Package, 28-Pin TSSOP with Exposed Thermal Pad

The products described here are manufactured under one or more U.S. patents or U.S. patents pending.

Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be

required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is

cautioned to verify that the information being relied upon is current.

The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility

for its use; nor for any infringement of patents or other rights of third parties which may result from its use.

Copyright©2005 AllegroMicrosystems, Inc.

A

1.20

MAX

.047

0.15

0

.006

.000

0.30

0.19

.012

.007

4.5

4.3

.177

.169

6.6

6.2

.260

.244

5

NOM

.200

3

NOM

.118

0.20

0.09

.008

.004

8º

0º

0.75

0.45

.030

.018

1

REF

.039

9.8

9.6

.386

.378

C

SEATING

PLANE

A

B

28X

0.10 [.004] M C

A

B

C

0.10 [.004]

28X

0.65 .026

0.25 .010

2

1

28

GAUGE PLANE

SEATING PLANE

B

Preliminary dimensions, for reference only

Dimensions in millimeters

U.S. Customary dimensions (in.) in brackets, for reference only

(reference JEDEC MO-153 AET)

Dimensions exclusive of mold flash, gate burrs, and dambar protrusions

Exact case and lead configuration at supplier discretion within limits shown

A

B

Terminal #1 mark area

Exposed thermal pad (bottom surface)