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VSC7440 데이터시트(PDF) 435 Page - Microsemi Corporation |
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VSC7440 데이터시트(HTML) 435 Page - Microsemi Corporation |
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435 / 444 page ![]() Package Information VMDS-10492 VSC7440 Datasheet Revision 4.2 418 Figure 152 • Package Drawing 8.2 Thermal Specifications Thermal specifications for this device are based on the JEDEC JESD51 family of documents. These documents are available on the JEDEC Web site at www.jedec.org. The thermal specifications are modeled using a four-layer test board with two signal layers, a power plane, and a ground plane (2s2p 0.20 (4×) X Y D D1 E e E1 e Ø b Ø 0.10 M Z Ø 0.25 M Z X Y Pin A1 corner Pin A1 corner 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 A B C D E F G H J K L M N P R T U V A1 A 2. 0.20 Z Z Seating plane 0.35 Z Dimensions Reference Minimum Nominal Maximum D E D1 E1 e A A1 b 19.00 BSC 19.00 BSC 17.00 BSC 17.00 BSC 1.00 BSC 1.54 1.67 1.80 0.31 0.43 0.44 0.64 3. Top View Bottom View Side View Notes 1. All dimensions and tolerances are in millimeters (mm). 2. Primary datum Z and seating plane are defined by the spherical crowns of the solder balls. 3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum Z. 4. Radial true position is represented by typical values. |
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