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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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STM32G071C8 데이터시트(PDF) 126 Page - STMicroelectronics |
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STM32G071C8 데이터시트(HTML) 126 Page - STMicroelectronics |
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126 / 133 page  Package information STM32G071x8/xB 126/133 DS12232 Rev 3 6.8 WLCSP25 package information Figure 53. WLCSP25 chip-scale package outline 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. Table 82. WLCSP25 mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A(2) - - 0.59 - - 0.023 A1 - 0.18 - - 0.007 - A2 - 0.38 - - 0.015 - A3 - 0.025(3) -- 0.001 - b 0.22 0.25 0.28 0.009 0.010 0.011 D 2.28 2.30 2.32 0.090 0.091 0.091 E 2.46 2.48 2.50 0.097 0.098 0.098 e - 0.40 - - 0.016 - e1 - 1.60 - - 0.063 - A06J_WLCSP25_ME_V1 Z A B C D E 21 3 4 5 G e e e2 e1 F A1 ball location D E aaa (4X) BOTTOM VIEW TOP VIEW A A2 A1 bbb Z DETAIL A A3 A2 b FRONT VIEW SIDE VIEW DETAIL A ROTATED 90 BUMP eee Z b (25x) ccc Z Y X ddd Z M M A1 |
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