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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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STM32G071C8 데이터시트(PDF) 127 Page - STMicroelectronics |
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STM32G071C8 데이터시트(HTML) 127 Page - STMicroelectronics |
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127 / 133 page  DS12232 Rev 3 127/133 STM32G071x8/xB Package information 128 Figure 54. Recommended PCB pad design for WLCSP25 package e2 - 1.60 - - 0.063 - F(4) - 0.350 - - 0.014 - G(4) - 0.440 - - 0.017 - aaa - - 0.10 - - 0.004 bbb - - 0.10 - - 0.004 ccc - - 0.10 - - 0.004 ddd - - 0.05 - - 0.002 eee - - 0.05 - - 0.002 1. Values in inches are converted from mm and rounded to 3 decimal digits. 2. The maximum total package height is calculated by the RSS method (Root Sum Square) using nominal values and tolerances of A1 and A2. 3. Back side coating. Nominal dimension is rounded to the 3rd decimal place resulting from process capability. 4. Calculated dimensions are rounded to the 3rd decimal place Table 83. Recommended PCB pad design rules for WLCSP25 package Dimension Recommended value (mm) Pitch 0.4 Dpad 225 Dsm 0.290 typ.(1) 1. Depends on the solder mask registration tolerance Stencil opening 0.250 Stencil thickness 0.100 Table 82. WLCSP25 mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max MS18965V2 Dsm Dpad |
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