TP2502 datasheet(3/14 Pages) MICROCHIP

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AC ELECTRICAL CHARACTERISTICS

Electrical Specifications: TA = 25°C unless otherwise specified. Specification is obtained by characterization and

is not 100% tested.

Parameter

Sym. Min. Typ. Max.

Unit

Conditions

Forward Transconductance

GFS

300

650

—

mmho VDS = –15V, ID = –1A

Input Capacitance

CISS

—

125

VGS = 0V,

VDS = –20V,

f = 1 MHz

Common Source Output Capacitance

COSS

—

Reverse Transfer Capacitance

CRSS

—

Turn-On Delay Time

td(ON)

—

VDD = –20V,

ID = –1A,

RGEN = 25Ω

Rise Time

—

Turn-Off Delay Time

td(OFF) —

—

Fall Time

—

DIODE PARAMETER

Diode Forward Voltage Drop

VSD

—

–1.3

–2

VGS = 0V, ISD = –1.5A (Note 1)

Reverse Recovery Time

trr

—

300

—

VGS = 0V, ISD = –1.5A

Note 1: Unless otherwise stated, all DC parameters are 100% tested at 25°C. Pulse test: 300 µs pulse, 2% duty

cycle

TEMPERATURE SPECIFICATIONS

Parameter

Sym.

Min.

Typ. Max.

Unit

Conditions

TEMPERATURE RANGE

Operating Junction Temperature

–55

—

+150

°C

Storage Temperature

–55

—

+150

°C

PACKAGE THERMAL RESISTANCE

3-lead SOT-89

JA

—

133

—

°C/W

THERMAL CHARACTERISTICS

Package

ID (Note 1)

(Continuous)

(mA)

(Pulsed)

(A)

Power Dissipation

at TA = 25°C

(Note 2)

(W)

IDR (Note 1)

(mA)

IDRM

(A)

3-lead SOT-89

–630

–3.3

1.6

–630

–3.3

Note 1: ID (continuous) is limited by maximum rated TJ.

2: Mounted on an FR4 board, 25 mm x 25 mm x 1.57 mm

 2019 Microchip Technology Inc.

DS20005962A-page 3

TP2502

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