ADP5600ACPZ-R7 datasheet(6/25 Pages) AD

6 / 25 page

ADP5600

Data Sheet

Rev. 0 | Page 6 of 25

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

VIN, C1+, C2+, EN to GND

−0.3 V to +20 V

PGOOD to GND

−0.3V to +20 V

SYNC to GND

−0.3V to +5.5 V

FREQ to GND

−0.3V to +2.5 V

SEL1, SEL2 to GND

−0.3V to +2.5 V

C1−, C2−, CPOUT, LDO_OUT to GND

−20 V to +0.3 V

FB to GND

−5.5 V to +0.3 V

Operating Junction Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in the circuit board (4-layer, JEDEC standard board)

for surface mount packages.

Table 6. Thermal Resistance

Package Type

θJA

θJC

ΨJT

Unit

CP-16-171

45.42

2.22

0.52

°C/W

θJA, θJC, and ΨJT are based on a 4-layer PCB (two signal and two power planes)

with four thermal vias connecting the exposed pad to the ground plane.

ESD CAUTION

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