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M24128X-FCU6/TF 데이터시트(PDF) 27 Page - STMicroelectronics |
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M24128X-FCU6/TF 데이터시트(HTML) 27 Page - STMicroelectronics |
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27 / 35 page ![]() Figure 16. Ultra thin WLCSP- 4-bump, 0.851 x 0.851 mm, with BSC, wafer level chip scale package outline Wafer back side Side view Orientation reference (4X) aaa E D X Y Detail A bbb Z A2 A Bump A1 Z Detail A Rotated 90 ° eee Z b (4X) e1 G G F e Seating plane Orientation reference X Y Ø ddd M Z Ø ccc M Z F Back side coating thickness 0.025 mm A3 1. Drawing is not to scale. 2. Primary datum Z and seating plane are defined by the spherical crowns of the bump. M24128X-FCU Ultra thin WLCSP4 package information DS12680 - Rev 2 page 27/35 |
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