| 전자부품 데이터시트 검색엔진 |
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AF3185 데이터시트(PDF) 2 Page - 3M Electronics |
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AF3185 데이터시트(HTML) 2 Page - 3M Electronics |
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2 / 4 page ![]() Scotch-WeldTM Structural Adhesive Film AF 3185 - 2 - Application Proper application is as important as proper design and laminating adhesive choice to obtain maximum laminate properties. Improper laminating techniques can result in partial or complete failure of an assembly. Laminate Preparation: Laminate Lay-up: 1. Cut portion of film to be used with protective liner in place. 2. Place film on part. 3. Roll in place with rubber roller. Heating film slightly will increase its tackiness. 4. Remove protective liner. 5. Repeat procedure until the desired number of plies are obtained. Mechanical Performance 75°F 4600 psi 31.7 MPa Overlap Shear ASTM D 1002 Metal: FPL etched 2024-T3 bare aluminum Cure cycle: 200 ± 5°F - 12 to 15 psig - 6 hours - 9°F/minute rise rate Test load rate: 1200-1400 psi/minute (0.05 inches/minute) Test Temp Peel Rate Peel Strength 75°F 1"/min 41 in lb/in 75°F 3"/min 47 in lb/in Metal to Metal Climbing Drum Peel ASTM D 1781 Metal: FPL etched 2024-T3 clad aluminum Cure cycle: 235 ± 5°F - 35 psig - 90 minutes - 5°F/minute rise rate |
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