Structural Adhesive Film

AF 3185

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Cure Cycle

A. General Cure Requirements

The cure requirements for Scotch-Weld AF 3185 film are a function of Scotch-

Weld AF 3185 film properties. Specific application, equipment available,

production limitations and bond properties required. General cure properties of

Scotch-Weld AF 3185 film are as follows:

1. Cure Pressure:

Pressure is required during cure to form a high strength bond. Pressure may be

applied by use of an autoclave, press, or vacuum bag.

2. Cure Temperature:

The cure temperature may be varied from 200°F to 350°F (93°C to 177°C)

depending upon the materials being used, equipment available and properties

desired. Scotch-Weld AF 3185 film will soften as temperature is increased and

cure will be initiated at 200°F (93°C) and a low strength gel formed.

Continued heating chemically converts this gel into a high strength, solvent

resistance bondline.

3. Cure Time:

Cure time depends upon the cure temperature used, methods heat application,

production limitations and bond properties required. Since no two operations

are exactly alike, it is recommend that a few simple experiments be conducted

varying both temperature and cure time to determine optimum conditions for

the particular application.

B. Suggested Cure Cycle

The following cure cycle has been used to obtain high strength bonds in our

laboratory.

1. Apply a positive pressure of 25 psi (0.17 MPa) and maintain throughout the

cure cycle.

2. Raise the temperature from ambient to 250°F (121°C) at a 5°F/minute rise rate

(2.8°C/minute rise).

3. Cure for 60 minutes at 250°F (121°C).

4. Cool to below 100°F (38°C) prior to release of positive pressure.

Storage

Scotch-Weld AF 3185 film must be stored at 0°F (-18°C) for lower. It should be

permitted to warm thoroughly to room temperature before using to prevent moisture

condensation.

Shelf Life

When stored at 0°F (-18°C) or below, the 3M Standard shelf life for Scotch-Weld

AF 3185 film is 6 months from date of shipment from 3M.