6.4 Thermal Information

THERMAL METRIC(1)

ISO674x

UNIT

DW (SOIC)

16 PINS

Junction-to-ambient thermal resistance

73

°C/W

Junction-to-case (top) thermal resistance

36.1

°C/W

Junction-to-board thermal resistance

40.4

°C/W

Junction-to-top characterization parameter

17

°C/W

Junction-to-board characterization parameter

39.9

°C/W

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO6740

Maximum power dissipation (both sides)

pF, Input a 25-MHz 50% duty cycle

square wave

130.9

mW

Maximum power dissipation (side-1)

33

mW

Maximum power dissipation (side-2)

97.9

mW

ISO6741

Maximum power dissipation (both sides)

pF, Input a 25-MHz 50% duty cycle

square wave

134.9

mW

Maximum power dissipation (side-1)

50.8

mW

Maximum power dissipation (side-2)

84.1

mW

www.ti.com

ISO6740, ISO6741, ISO6742

SLLSFJ6C – DECEMBER 2019 – REVISED JANUARY 2021

Copyright © 2021 Texas Instruments Incorporated

Submit Document Feedback

7

Product Folder Links: ISO6740 ISO6741 ISO6742