| 전자부품 데이터시트 검색엔진 |
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SWIFO111E 데이터시트(PDF) 16 Page - Seoul Semiconductor |
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SWIFO111E 데이터시트(HTML) 16 Page - Seoul Semiconductor |
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16 / 23 page ![]() R00 January 9, 2020 www.seoulsemicon.com Product Data Sheet SWIFO111E – WICOP 16 Reflow Soldering Characteristics (1) Reflow solder conditions / profile Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. Reflow condition Pb-Free assembly Average ramp-up rate (T s-max to Peak) 2~3℃ / second Preheat Temperature Min (T s-min) 150℃ Preheat Temperature Max (T s-max) 200℃ Preheat Time (T s) Min 80 seconds Time maintained above : Liquidus Temperature (T L) 217~220℃ Time maintained above : Time (T L) 60~150 seconds Peak Temperature (T P) 250℃ Time Within 5℃ of actual Peak Temperature (t P) 20~40 seconds Ramp-down rate 4~6℃ / seconds Time 25℃ to peak Temperature 6 minutes max |
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