Data Sheet

ADPA7004CHIPS

Rev. 0 | Page 5 of 20

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

4.5 V

−2 V dc to 0 V dc

RF Input Power (RFIN)

18 dBm

85°C)

3.04 W

Temperature

Storage Range (Ambient)

−65°C to +150°C

Operating Range (Die Bottom)

−55°C to +85°C

Junction Temperature to Maintain

1,000,000 Hours Mean Time to Failure (MTTF)

175

142

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to system design and

operating environment. Careful attention to printed circuit

board (PCB) thermal design is required.

of die attach epoxy.

Table 5.

Package Type

Unit

C-16-4

29.6

°C/W

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of

ESD-sensitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDDEC JS-001.

ESD Ratings ADPA7004CHIPS

Table 6. ADPA7004CHIPS, 16-Pad CHIP

ESD Model

Withstand Threshold (V)

Class

HBM

±125

0

ESD CAUTION