11

RFD10P03L, RFD10P03LSM, RFP10P03L

TO-252AA

SURFACE MOUNT JEDEC TO-252AA PLASTIC PACKAGE

LEAD NO. 1

-

GATE

LEAD NO. 3

-

SOURCE

TERM. 4

-

DRAIN

E

D

L

e

b

13

A

L

c

SEATING

BACK VIEW

2

TERM. 4

0.265

MINIMUM PAD SIZE RECOMMENDED FOR

SURFACE-MOUNTED APPLICATIONS

(6.7)

0.265 (6.7)

0.070 (1.8)

0.118 (3.0)

0.063 (1.6)

0.090 (2.3)

0.063 (1.6)

0.090 (2.3)

PLANE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

0.086

0.094

2.19

2.38

-

0.018

0.022

0.46

0.55

4, 5

b

0.028

0.032

0.72

0.81

4, 5

0.033

0.040

0.84

1.01

4

0.205

0.215

5.21

5.46

4, 5

0.190

-

4.83

-

2

c

0.018

0.022

0.46

0.55

4, 5

D

0.270

0.290

6.86

7.36

-

E

0.250

0.265

6.35

6.73

-

e

0.090 TYP

2.28 TYP

7

0.180 BSC

4.57 BSC

7

0.035

0.045

0.89

1.14

-

0.040

0.045

1.02

1.14

-

L

0.100

0.115

2.54

2.92

-

0.020

-

0.51

-

4, 6

0.025

0.040

0.64

1.01

3

0.170

-

4.32

-

2

NOTES:

1. These dimensions are within allowable dimensions of Rev. B of

JEDEC TO-252AA outline dated 9-88.

terminal 4.

3. Solder finish uncontrolled in this area.

4. Dimension (without solder).

5. Add typically 0.002 inches (0.05mm) for solder plating.

7. Position of lead to be measured 0.090 inches (2.28mm) from bottom

of dimension D.

8. Controlling dimension: Inch.

9. Revision 6 dated 10-96.