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FXLS8964AF 데이터시트(PDF) 84 Page - NXP Semiconductors

부품명 FXLS8964AF
상세설명  3-Axis Low-g Accelerometer
PDF  98 Pages
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제조업체  NXP [NXP Semiconductors]
홈페이지  http://www.nxp.com
Logo NXP - NXP Semiconductors

FXLS8964AF 데이터시트(HTML) 84 Page - NXP Semiconductors

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NXP Semiconductors
FXLS8964AF
3-Axis Low-g Accelerometer
FXLS8964AF
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2020. All rights reserved.
Objective data sheet
Rev. 2 — 30 October 2020
84 / 98
Table 118. SELF_TEST_CONFIG2 register (address 38h) bit description
Field
Description
3:0
ST_DEC
Self-Test measurement phase decimation factor
This bit field selects the Self-Test measurement phase decimation factor.
The decimation selection ranges from 1 to 4096 as shown in the table below.
Table 119. Self-Test measurement phase decimation settings
ST_DEC[3] ST_DEC[2] ST_DEC[1] ST_DEC[0] Decimation
selection
(Number of
samples
Self-Test
measurement
period
(ms)
Self-Test ODR
(Hz)
0
0
0
0
1
0.3125
3200
0
0
0
1
2
0.625
1600
0
0
1
0
4
1.25
800
0
0
1
1
8
2.5
400
0
1
0
0
16
5
200
0
1
0
1
32
10
100
0
1
1
0
64
20
50
0
1
1
1
128
40
25
1
0
0
0
256
80
12.5
1
0
0
1
512
160
6.25
1
0
1
0
1024
320
3.125
1
0
1
1
2048
640
1.563
1
1
0
0
4096
1280
0.78125
1
1
0
1
4096
1280
0.78
1
1
1
0
4096
1280
0.781
1
1
1
1
4096
1280
0.781
Note:
• During the self-test sequence, the accelerometer measurement period in μs (for each
axis and each direction) is given by the following equation:
ST_PERIOD μs = 2ST_DEC[3:0] * [312.5 + (ST_IDLE[4:0] * 31.25) µs]
• The user-selected ODR and power mode settings are ignored during self-test
operation. The user-selected settings for ODR and power mode are applied after self-
test is disengaged, for example,
SENSCONFIG1[...]ST_AXIS_SEL[1:0] = 00b.
14 Printed circuit board layout and device mounting
Printed Circuit Board (PCB) layout and device mounting are critical to the overall
performance of the design. The footprint for the surface mount packages must be the
correct size as a base for a proper solder connection between the PCB and the package.
This, along with the recommended soldering materials and techniques, will optimize
assembly and minimize the stress on the package after board mounting.



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