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2020 Microchip Technology Inc.

DS00003412A-page 13

UPD301B/C

3.0

PIN DESCRIPTIONS AND CONFIGURATION

3.1

Pin Assignments

The device pin diagram for the UPD301B/C can be seen in Figure 3-1. Table 3-1 provides a UPD301B/C pin assignment

table. The internal bonding diagram (simplified) is shown in Figure 3-2. Pin descriptions are provided in Section 3.2, "Pin

Descriptions".

FIGURE 3-1:

UPD301B/C PIN ASSIGNMENTS (TOP VIEW)

Microchip

UPD301B/C

(Top View 40-VQFN)

Note: Exposed pad (VSS) on bottom of package must be connected to ground.

SPI_IRQ_N0 (PA14)

22

23

24

25

26

27

28

29

9

8

7

6

5

4

3

2

CC2

VCONN_IN

CC1

VDD12_CORE_OUT

VDD33_REG_IN

SWCLK (PA30)

SWDIO (PA31)

VBUS_DET_IN

VPP18

GPIO3

GPIO2

SPI_MOSI (PA11)

SPI_SS0 (PA10)

SPI_CLK (PA09)

SPI_MISO (PA08)

Thermal slug connects to VSS

10

PA00

21

VDD33_ANA_IN

1

PA28

PA15

30